Barium (Ba) Sputtering Targets
Purity: 99.5% | Size: 4” | Thickness: 0.125”
Sputtering is a proven method for depositing thin films on a wide range of substrates. This barium sputtering target ensures repeatable performance and can scale from small research projects to medium- or large-scale production. Reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters, providing precise control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates such as silicon wafers.
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Semiconductor etching where high anisotropy is required.
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Material analysis, including SIMS, for detecting trace impurities.
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Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium (Ba):
Barium (atomic number 56) is an alkaline-earth metal with excellent electrical properties, ideal for sputtering applications. It is used in electronic device plating, semiconductor devices, and flat panel displays. Barium can form alloys with metals like strontium and titanium, enhancing properties for specialized sputtering applications.
