Barium (Ba) Sputtering Targets
Purity: 99.5% | Size: 3” | Thickness: 0.125”
Barium sputtering targets are engineered for precise thin-film deposition on various substrates. The sputtering process is repeatable and scalable, suitable for both research-scale projects and medium-to-large production batches. Reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, providing fine control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates such as silicon wafers.
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Semiconductor etching where high anisotropy is required.
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Material analysis, including SIMS, for detecting trace impurities.
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Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium (Ba):
Barium (atomic number 56) is an alkaline-earth metal with excellent electrical properties, making it ideal for sputtering applications. It is used in electronic device plating, semiconductor devices, and flat panel displays. Barium can form alloys with metals like strontium and titanium to tailor properties for specialized sputtering uses.
