Barium (Ba) Sputtering Targets
Purity: 99.5% | Size: 2” | Thickness: 0.250”
Barium sputtering targets are designed for precise thin-film deposition on a variety of substrates. The sputtering process is highly repeatable and scalable, making it suitable for both research-scale projects and medium-to-large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, giving experts fine control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates such as silicon wafers.
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Semiconductor etching requiring high anisotropy.
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Material analysis, including SIMS, for detecting trace impurities.
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Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium (Ba):
Barium (atomic number 56) is an alkaline-earth metal with excellent electrical properties, ideal for sputtering applications. It is used in electronic device plating, semiconductor devices, and flat panel displays. Barium can form alloys with metals such as strontium and titanium, offering tailored properties for specialized sputtering uses.
