Barium (Ba) Sputtering Targets
Purity: 99.5% | Size: 2” | Thickness: 0.125”
Barium sputtering targets are engineered for precise thin-film deposition across diverse substrate shapes and sizes. The sputtering process is repeatable and scalable, supporting both small research projects and medium-to-large production batches. Depending on process parameters, chemical reactions can occur on the target surface, in-flight, or on the substrate, allowing experts fine control over film growth and microstructure.
Applications:
-
Thin-film deposition on substrates such as silicon wafers.
-
Semiconductor etching where high anisotropy is required.
-
Material analysis, including SIMS, for detecting trace impurities.
-
Space applications: sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium (Ba):
Barium (atomic number 56) is an alkaline-earth metal with excellent electrical properties, making it ideal for sputtering applications. It is used in electronic device plating, semiconductors, and flat panel displays. Barium can form alloys with metals such as strontium and titanium, providing tailored properties for specialized sputtering uses.
