Barium (Ba) Sputtering Targets
Purity: 99.5% | Size: 1” | Thickness: 0.250”
Barium sputtering targets are engineered for precise thin-film deposition on a variety of substrate shapes and sizes. The sputtering process is reliable, repeatable, and scalable, supporting both small-scale research and medium-to-large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, allowing experts precise control over film growth and microstructure.
Applications:
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Thin-film deposition on substrates, including silicon wafers.
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Semiconductor etching requiring high anisotropy.
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Material analysis, such as SIMS, for detecting trace impurities.
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Space applications, where sputtering contributes to space weathering on airless bodies like asteroids and the Moon.
About Barium (Ba):
Barium (atomic number 56) is an alkaline-earth metal with excellent electrical properties, making it ideal for sputtering. It is commonly used for electronic device plating, semiconductors, and flat panel displays. Barium can form alloys with metals such as strontium and titanium, enabling customized properties for specialized sputtering applications.
