Aluminum Silicon Copper (AlCuSi) Sputtering Targets
Purity: 99.999% Size: 3” Thickness: 0.250”
AlCuSi sputtering targets are designed for precise thin-film deposition across a wide variety of substrate shapes and sizes. The sputtering process is repeatable, scalable, and adaptable for both research and production. Reactions can occur on the target surface, in-flight, or on the substrate, giving experts precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Deposits material from the target onto substrates, such as silicon wafers, creating uniform, high-quality films. -
Semiconductor Etching:
Suitable for sputter etching when high anisotropy is needed and selectivity is not critical. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry, allowing composition determination and detection of trace impurities. -
Space Applications:
Plays a role in space weathering, which alters the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages of AlCuSi Targets
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Lightweight yet high-strength aluminum alloy, enhanced with copper and silicon.
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Higher strength compared to standard aluminum-silicon alloys, making it ideal for aerospace and transportation applications.
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Excellent casting, machining, corrosion resistance, and weldability.
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Suitable for engine parts, gas and oil pans, and other commercial applications.
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High purity ensures uniform thin films for semiconductor applications.
