Aluminum Silicon (AlSi) Sputtering Targets
Purity: 99.999% Size: 4” Thickness: 0.250”
Aluminum Silicon (AlSi) sputtering targets are engineered for high-precision thin-film deposition across a wide range of substrate materials and shapes. Sputtering is a well-established and repeatable technique, suitable for both research-scale experiments and medium- to large-area production batches. Depending on process parameters, chemical reactions may occur on the target surface, during particle transport, or directly on the substrate—allowing experts extensive control over film microstructure and growth behavior.
Applications of Sputtering Targets
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Thin-Film Deposition:
Used to deposit thin films by sputtering, where material is uniformly eroded from the target surface and transferred onto substrates such as silicon wafers. -
Semiconductor Manufacturing:
Utilized in sputter etching applications when high etching anisotropy is required, even when selectivity is not a primary factor. -
Analytical Techniques (SIMS):
In secondary ion mass spectrometry, materials are sputtered at a constant rate to measure the identity and concentration of ejected atoms. This enables precise compositional analysis and detection of extremely low impurity levels. -
Space and Planetary Science:
Sputtering contributes to space weathering processes that alter the chemical and physical properties of airless bodies like asteroids and the Moon.
