Aluminum Silicon (AlSi) Sputtering Targets
Purity: 99.999% Size: 3” Thickness: 0.250”
Aluminum Silicon (AlSi) sputtering targets are engineered for precise thin-film deposition across diverse substrate shapes and sizes. The sputtering process is highly repeatable and scalable, making it suitable for small R&D projects as well as medium-to-large production batches. Depending on process parameters, chemical reactions can occur on the target surface, during particle transport, or directly on the substrate, giving experts fine control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Transfers material from the target source onto substrates such as silicon wafers to create uniform thin films. -
Semiconductor Etching:
Sputter etching provides high anisotropy for cases where selectivity is not critical. -
Material Analysis (SIMS):
Enables secondary ion mass spectrometry by sputtering the target at a constant rate, allowing precise measurement of elemental composition and trace impurities. -
Space Applications:
Contributes to space weathering processes that alter the chemical and physical properties of airless bodies, such as asteroids and the Moon.
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Download ……………………….. MSDS
