Aluminum Silicon (AlSi) Sputtering Targets
Purity: 99.999% Size: 3” Thickness: 0.125”
Aluminum Silicon (AlSi) sputtering targets are designed for precise thin-film deposition across various substrate shapes and sizes. The sputtering process is highly repeatable and scalable, suitable for both small research projects and medium-to-large production batches. Chemical reactions can occur on the target surface, during particle transport, or on the substrate depending on process parameters, giving experts fine control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Transfers material from the target source onto substrates such as silicon wafers to form uniform thin films. -
Semiconductor Etching:
Sputter etching allows high anisotropy when selectivity is not critical. -
Material Analysis (SIMS):
Enables secondary ion mass spectrometry, measuring elemental composition and trace impurities with high precision. -
Space Applications:
Contributes to space weathering, altering physical and chemical properties of airless bodies like asteroids and the Moon.
