Aluminum Silicon (AlSi) Sputtering Targets
Purity: 99.999% Size: 1” Thickness: 0.250”
Aluminum Silicon (AlSi) sputtering targets enable precise thin-film deposition on a variety of substrate shapes and sizes. The process is repeatable and scalable, making it suitable for research projects as well as medium-to-large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate, giving experts extensive control over film growth and microstructure.
Applications of Sputtering Targets
-
Thin-Film Deposition:
Deposits material from the target onto substrates, such as silicon wafers, to form uniform films. -
Semiconductor Etching:
Ideal for sputter etching when high anisotropy is required and selectivity is not critical. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry for determining target composition and detecting trace impurities. -
Space Applications:
Plays a role in space weathering, modifying the physical and chemical properties of airless bodies like asteroids and the Moon.
