Aluminum Silicon (AlSi) Sputtering Targets
Purity: 99.999% Size: 1” Thickness: 0.125”
Aluminum Silicon (AlSi) sputtering targets are designed for precise thin-film deposition across various substrate shapes and sizes. The sputtering process is repeatable and scalable, making it suitable for research, development, and production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate, allowing experts fine control over film growth and microstructure.
Applications of Sputtering Targets
-
Thin-Film Deposition:
Deposits material from the target onto substrates, such as silicon wafers, to form uniform thin films. -
Semiconductor Etching:
Ideal for sputter etching when high anisotropy is needed and selectivity is not critical. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry to determine target composition and detect trace impurities. -
Space Applications:
Plays a role in space weathering, modifying the physical and chemical properties of airless bodies like asteroids and the Moon.
