Aluminum (Al) Sputtering Targets
Purity: 99.999%
Size: 6”
Thickness: 0.250”
Aluminum sputtering targets provide reliable thin-film deposition on a wide range of substrates. The sputtering process is highly repeatable and scalable, suitable for both small R&D projects and medium-to-large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate, offering precise control over film growth and microstructure.
Applications
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Thin-Film Deposition:
Uniform aluminum films on substrates like silicon wafers. -
Semiconductor Etching:
Ideal for sputter etching where high anisotropy is needed and selectivity is not critical. -
Material Analysis (SIMS):
Enables precise determination of material composition and trace impurities. -
Space Applications:
Used in simulating space weathering, altering the physical and chemical properties of airless bodies such as asteroids and the Moon.
Material Advantages
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Silvery-white, soft, ductile, lightweight, strong, durable, and corrosion-resistant.
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Forms a thin, strong oxide layer for enhanced durability.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
Aluminum sputtering targets are engineered for high performance in research, semiconductor, and advanced material applications.
