Aluminum (Al) Sputtering Targets
Purity: 99.999% Size: 3” Thickness: 0.250”
Aluminum sputtering targets are designed to deposit uniform thin films on a wide variety of substrate shapes and sizes. The sputtering process is highly repeatable and scalable, suitable for research and development as well as medium-to-large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters, giving precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Transfers material from the target to substrates such as silicon wafers to create uniform films. -
Semiconductor Etching:
Ideal for sputter etching when high anisotropy is required, even when selectivity is not critical. -
Material Analysis (SIMS):
Enables accurate composition analysis and detection of trace impurities via secondary ion mass spectrometry. -
Space Applications:
Used in studying space weathering, which alters the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, and ductile metal.
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Excellent corrosion resistance due to a thin, strong oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and low particle formation during sputtering.
