Aluminum (Al) Sputtering Targets
Purity: 99.999% Size: 3” Thickness: 0.125”
Aluminum sputtering targets are ideal for depositing high-quality thin films on various substrate shapes and sizes. The process is reliable, scalable, and suitable for both research and production, offering precise control over film growth and microstructure. Depending on parameters, chemical reactions can occur on the target surface, in-flight, or on the substrate.
Applications
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Thin-Film Deposition:
Enables uniform material transfer from the target to substrates like silicon wafers. -
Semiconductor Etching:
Suitable for sputter etching requiring high anisotropy without stringent selectivity. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry to measure composition and detect trace impurities. -
Space Applications:
Useful for studying space weathering processes affecting asteroids, the Moon, and other airless bodies.
Material Advantages
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Silvery-white, lightweight, soft, and ductile metal.
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Excellent corrosion resistance due to a strong, thin oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
