Aluminum (Al) Sputtering Targets
Purity: 99.999% Size: 2” Thickness: 0.250”
Aluminum sputtering targets deliver precise and uniform thin film deposition across a variety of substrate shapes and sizes. The process is highly repeatable, scalable from R&D to production batches, and allows fine control over film growth and microstructure. Chemical reactions can occur on the target surface, in-flight, or on the substrate, depending on process parameters.
Applications
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Thin-Film Deposition:
Facilitates uniform erosion of target material onto substrates like silicon wafers. -
Semiconductor Etching:
Ideal for high anisotropy etching where selectivity is not critical. -
Material Analysis (SIMS):
Enables compositional analysis and detection of trace impurities through controlled sputtering. -
Space Applications:
Useful for simulating space weathering processes on airless bodies, including asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, ductile, and soft metal.
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Strong corrosion resistance via a durable oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
