Aluminum (Al) Sputtering Targets
Purity: 99.999%
Size: 1”
Thickness: 0.125”
Aluminum sputtering targets are ideal for depositing thin films on a variety of substrate shapes and sizes. The sputtering process is repeatable, scalable, and adaptable for research as well as production batches. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate, giving precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Deposits aluminum material from the target onto substrates such as silicon wafers, forming uniform, high-quality films. -
Semiconductor Etching:
Used for sputter etching where high anisotropy is required, with selectivity being a lesser concern. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry, enabling accurate composition analysis and detection of trace impurities. -
Space Applications:
Relevant in studies of space weathering, which affects the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, ductile, and corrosion-resistant.
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Forms a thin but strong oxide layer for enhanced durability.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and reduces particle formation during sputtering.
