Aluminum (Al) Sputtering Targets
Purity: 99.99% Size: 8” Thickness: 0.250”
Aluminum sputtering targets are engineered for precise thin film deposition on a variety of substrates. The sputtering process is highly repeatable and scalable, suitable for small R&D projects as well as medium-to-large production batches. Chemical reactions can occur on the target surface, in-flight, or on the substrate depending on process parameters, giving experts control over film growth and microstructure.
Applications
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Thin-Film Deposition:
Uniform aluminum film deposition onto substrates such as silicon wafers. -
Semiconductor Etching:
Ideal for sputter etching where high anisotropy is required and selectivity is not critical. -
Material Analysis (SIMS):
Enables determination of target composition and detection of trace impurities through mass spectrometry. -
Space Applications:
Simulates space weathering, affecting the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Aluminum (Al) is a silvery-white, soft, ductile metal that is lightweight, strong, durable, and corrosion-resistant.
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Forms an extremely thin but strong oxide layer for enhanced durability.
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Exhibits high thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and low susceptibility to particle formation during sputtering.
Aluminum sputtering targets provide reliable performance for high-precision thin film applications in research, semiconductor processing, and advanced material engineering.
