Aluminum (Al) Sputtering Targets
Purity: 99.99% Size: 4” Thickness: 0.250”
Aluminum sputtering targets are designed for the deposition of high-quality thin films on diverse substrate shapes and sizes. The sputtering process is repeatable and scalable, making it suitable for both small R&D projects and medium-to-large production batches. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate, offering precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Erodes material from the target onto substrates such as silicon wafers to form uniform thin films. -
Semiconductor Etching:
Ideal for sputter etching when high anisotropy is required and selectivity is not a primary concern. -
Material Analysis (SIMS):
Allows precise composition analysis and detection of trace impurities via secondary ion mass spectrometry. -
Space Applications:
Used in studies of space weathering, affecting the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, and ductile metal.
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Exceptional corrosion resistance with a thin, durable oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
