Aluminum (Al) Sputtering Targets
Purity: 99.99% Size: 3” Thickness: 0.250”
Aluminum sputtering targets provide a reliable solution for depositing uniform thin films on diverse substrate shapes and sizes. The sputtering process is repeatable, scalable, and suitable for both R&D and medium-to-large production batches. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate, offering precise control over film growth and microstructure.
Applications
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Thin-Film Deposition:
Transfers material from the target onto substrates such as silicon wafers to produce uniform films. -
Semiconductor Etching:
Ideal for sputter etching when high anisotropy is required, even if selectivity is not a priority. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry to determine composition and detect trace impurities. -
Space Applications:
Used to study space weathering, which affects the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, and ductile metal.
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Excellent corrosion resistance due to a strong, thin oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
