Aluminum (Al) Sputtering Targets
Purity: 99.99% Size: 3” Thickness: 0.125”
Aluminum sputtering targets provide reliable, high-quality thin film deposition on a wide range of substrate shapes and sizes. The process is repeatable, scalable, and allows precise control over film growth and microstructure. Depending on the process parameters, chemical reactions can occur on the target surface, in-flight, or on the substrate.
Applications
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Thin-Film Deposition:
Enables uniform material transfer from the target to substrates like silicon wafers. -
Semiconductor Etching:
Suitable for sputter etching requiring high anisotropy without stringent selectivity. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry to measure composition and detect trace impurities. -
Space Applications:
Useful for simulating and studying space weathering on airless bodies such as asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, and ductile metal.
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Strong corrosion resistance due to a durable oxide layer.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and low particle formation during sputtering.
