Aluminum (Al) Sputtering Targets
Purity: 99.99%
Size: 2”
Thickness: 0.125”
Aluminum sputtering targets are ideal for depositing thin films on various substrate shapes and sizes. The sputtering process is repeatable and scalable, suitable for both research and production. Chemical reactions can occur on the target surface, in-flight, or on the substrate, giving precise control over film growth and microstructure.
Applications of Sputtering Targets
-
Thin-Film Deposition:
Transfers material from the target to substrates like silicon wafers, forming uniform, high-quality films. -
Semiconductor Etching:
Suitable for sputter etching when high anisotropy is needed, even when selectivity is not critical. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry to determine target composition and detect trace impurities. -
Space Applications:
Relevant in space weathering studies, which alter the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
-
Silvery-white, lightweight, soft, ductile, and corrosion-resistant.
-
Forms a thin but strong oxide layer for enhanced durability.
-
High thermal and electrical conductivity.
-
Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
