Aluminum (Al) Sputtering Targets
Purity: 99.99%
Size: 1”
Thickness: 0.250”
Aluminum sputtering targets provide reliable thin-film deposition across a variety of substrate shapes and sizes. The sputtering process is repeatable and scalable, suitable for both research and production. Chemical reactions can occur on the target surface, in-flight, or on the substrate, giving precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Erodes material from the target onto substrates such as silicon wafers to form uniform, high-quality films. -
Semiconductor Etching:
Used for sputter etching where high anisotropy is required, even when selectivity is less critical. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry to determine target composition and detect trace impurities. -
Space Applications:
Relevant in space weathering studies, which alter the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, lightweight, soft, ductile, and corrosion-resistant.
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Forms a thin but strong oxide layer, enhancing durability.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
