Aluminum (Al) Sputtering Targets
Purity: 99.99% Size: 1” Thickness: 0.125”
Aluminum sputtering targets are ideal for depositing thin films onto a variety of substrate shapes and sizes. The sputtering process is repeatable, scalable, and adaptable for both research and production batches. Depending on process parameters, chemical reactions may occur on the target surface, in-flight, or on the substrate, allowing precise control over film growth and microstructure.
Applications of Sputtering Targets
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Thin-Film Deposition:
Deposits aluminum material from the target onto substrates, such as silicon wafers, forming uniform, high-quality films. -
Semiconductor Etching:
Suitable for sputter etching when high anisotropy is required and selectivity is not a concern. -
Material Analysis (SIMS):
Supports secondary ion mass spectrometry, enabling composition analysis and detection of trace impurities. -
Space Applications:
Used in studies of space weathering, which affects the physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages of Aluminum Targets
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Silvery-white, lightweight, ductile, and corrosion-resistant.
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Forms a thin but strong oxide layer for enhanced durability.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimizes particle formation during sputtering.
