Prime CZ-Si Wafer
Size: 8”, Orientation: (100), Phosphor Doped, 1-Side Polished, Thickness: 725 ± 20 μm
Technical Properties
| Property | Value |
|---|---|
| Quality | Prime |
| Materials | CZ-Si |
| Size (inch) | 8” |
| Orientation | (100) |
| Coating | — |
| Thickness (μm) | 725 ± 20 |
| Doping | Phosphor |
| Resistivity (ohm.cm) | 0.001-0.005 |
| Polished | One Side |
Description
Silicon is one of the most abundant elements in the Earth’s crust. Its primary applications in wafers are electronics and technological devices. Silicon wafers have very flat, mirror-like surfaces and are produced using the Czochralski (CZ) method to ensure the highest purity.
Depending on the intended application, silicon wafers can be doped with different elements to adjust their electronic properties. Common dopants include gallium, indium, boron, and nitrogen, which influence conductivity and performance.
Silicon wafers are widely used in semiconductors, microchips, integrated circuits, smartphones, computers, and other electronic devices. A wafer is a thin slice of semiconductor material that serves as the substrate for microelectronic components fabricated on its surface.
