Prime CZ-Si Wafer
Size: 6”, Orientation: (100), Boron Doped, 1-Side Polished, Thickness: 525±25um
Technical Properties:
| Quality | Prime |
|---|---|
| Materials | CZ-Si |
| Size (inch) | 6” |
| Orientation | (100) |
| Coating | |
| Thickness (μm) | 525±25um |
| Doping | Boron |
| Resistivity (ohm.cm) | 1-10 |
| Polished | One Side |
Silicon is one of the most abundant elements in the Earth’s crust. The primary use of silicon wafers lies in electronics and technology. These wafers possess exceptionally flat, mirror-like surfaces and are manufactured using the Czochralski method to achieve maximum purity. Depending on application needs, silicon wafers may be doped with various materials to adjust their purity and electronic characteristics. The type and concentration of dopants—such as gallium, indium, boron, and nitrogen—strongly influence their electrical behavior.
Silicon wafers are essential in semiconductors, microchips, integrated circuits, smartphones, computers, and numerous other electronic devices. As a fundamental platform for semiconductor technology, a wafer serves as a thin substrate that supports microelectronic components embedded within and above its surface.
