Prime CZ-Si Wafer
Size: 4”, Orientation: (100), Phosphor Doped, 2-Side Polished
Technical Properties
| Property | Value |
|---|---|
| Quality | Prime |
| Materials | CZ-Si |
| Size (inch) | 4” |
| Orientation | (100) |
| Coating | — |
| Thickness (μm) | 365 ± 15 |
| Doping | Phosphor |
| Resistivity (ohm.cm) | 0.05 – 0.152 |
| Polished | Double Side |
Description
Silicon is one of the most abundant elements in the Earth’s crust. Its primary use in wafers is for electronics and technological applications. Silicon wafers feature exceptionally flat, mirror-like surfaces and are produced via the Czochralski (CZ) method to achieve the highest purity.
Depending on the intended application, silicon wafers can be doped with specific elements to adjust their electronic properties. Common dopants include gallium, indium, boron, and nitrogen, each of which influences the wafer’s conductivity and performance characteristics.
Silicon wafers serve as the foundational platform for semiconductors, microchips, integrated circuits, smartphones, computers, and other electronic devices. A wafer is a thin slice of semiconductor material that acts as the substrate for microelectronic components fabricated on its surface.
