Prime CZ-Si Wafer
Size: 4”, Orientation: (100), Boron Doped, 1-Side Polished
Technical Properties:
| Quality | Prime |
|---|---|
| Materials | CZ-Si |
| Size (inch) | 4” |
| Orientation | (100) |
| Coating | |
| Thickness (μm) | 300 ± 25 |
| Doping | Boron |
| Resistivity (ohm.cm) | 1-10 |
| Polished | One Side |
Silicon is one of the most abundant elements in the Earth’s crust. The primary use of silicon wafers is in electronics and technological applications. These wafers feature exceptionally flat, mirror-like surfaces and are produced using the Czochralski method to achieve the highest purity. Depending on the intended application, silicon wafers can be doped with various materials to adjust their purity and electronic characteristics. The type and concentration of dopants—such as gallium, indium, boron, and nitrogen—significantly influence their electrical properties.
Silicon wafers are essential components in semiconductors, microchips, integrated circuits, smartphones, computers, and numerous other electronic systems. As the fundamental platform for semiconductor devices, a wafer serves as a thin substrate on which microelectronic components are fabricated and integrated.
