Prime CZ-Si Wafer
Size: 4”, Orientation: (100), Boron Doped, 2-Polished
Technical Properties:
| Quality | Prime |
|---|---|
| Materials | CZ-Si |
| Size (inch) | 4” |
| Orientation | (100) |
| Coating | |
| Thickness (μm) | 200 ± 10 μm |
| Doping | Boron |
| Resistivity (ohm.cm) | 0.001 – 0.005 |
| Polished | Double Side |
Silicon is one of the most common elements in the Earth’s crust. Its primary use lies in electronics and technology. Silicon wafers feature highly flat, mirror-like surfaces and are produced using the Czochralski method to achieve maximum purity. Depending on application requirements, silicon wafers can be doped with various materials to adjust their purity and electronic characteristics. The type and concentration of dopants significantly influence electronic behavior. Gallium, indium, boron, and nitrogen are among the dopants used during production.
Silicon wafers are essential in semiconductors, microchips, integrated circuits, smartphones, computers, and many other electronic devices. As a key platform for semiconductor components, a wafer serves as a thin substrate on which microelectronic structures are built and integrated.
