Prime CZ-Si Wafer
Size: 3”, Orientation: (100), Phosphor Doped, 1-Side Polished
Technical Properties:
| Quality | Prime |
|---|---|
| Materials | CZ-Si |
| Size (inch) | 3” |
| Orientation | (100) |
| Coating | |
| Thickness (μm) | 625±25um |
| Doping | Phosphor |
| Resistivity (ohm.cm) | 1-10 |
| Polished | One Side |
Silicon is one of the most abundant elements in the Earth’s crust. Its primary applications are in electronics and technology. Silicon wafers have extremely flat, mirror-like surfaces and are produced using the Czochralski method to achieve the highest purity. Depending on the intended use, wafers can be doped with various materials to tailor their purity and electronic properties. Dopants such as gallium, indium, boron, and nitrogen are commonly used in production.
Silicon wafers are essential in semiconductors, microchips, integrated circuits, smartphones, computers, and other electronic devices. A wafer serves as a thin substrate for microelectronic components built on and above its surface.
