Prime CZ-Si Wafer
Size: 2”, Orientation: (111), Boron Doped, 2-Side Polished
Technical Properties:
| Quality | Prime |
|---|---|
| Materials | CZ-Si |
| Size (inch) | 2” |
| Orientation | (111) |
| Coating | |
| Thickness (μm) | 500 ± 25 |
| Doping | Boron |
| Resistivity (ohm.cm) | 1-10 |
| Polished | Double Side |
Silicon is one of the most abundant elements in the Earth’s crust. Its primary applications are in electronics and technology. Silicon wafers feature extremely flat, mirror-like surfaces and are produced using the Czochralski method to achieve the highest purity. Depending on the application, wafers can be doped with different materials to tailor their purity and electronic properties. Dopants such as gallium, indium, boron, and nitrogen are commonly used in the production process.
Silicon wafers are essential in semiconductors, microchips, integrated circuits, smartphones, computers, and other electronic devices. A wafer serves as a thin substrate for microelectronic components built on and above its surface.
