Yttrium Ferrite (Y₃Fe₅O₁₂) Sputtering Targets — Indium Bonded
Technical Table
| Property | Specification |
|---|---|
| Material | Yttrium Ferrite (Y₃Fe₅O₁₂) |
| Bonding | Indium |
| Purity | 99.9% |
| Size | 2” |
| Thickness | 0.125” |
Description
Sputtering is a proven thin-film deposition technology used to coat a wide range of materials onto various substrate shapes and sizes. The sputter-target process is highly repeatable and can be scaled from small R&D projects to large-area production. Depending on process parameters, chemical reactions may occur on the target surface, during particle flight, or on the substrate. Although sputter deposition is complex, it provides excellent control over film growth and microstructure.
Applications
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Thin Film Deposition: Material is eroded from the sputtering target and deposited onto substrates such as silicon wafers.
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Semiconductor Processing: Used in sputter etching where high anisotropy is required.
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Material Analysis: Essential in SIMS, where sputtering enables measurement of atom concentrations and detection of trace impurities.
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Space Research: Sputtering contributes to space weathering, altering surface properties of airless bodies such as the Moon and asteroids.
