Product Table
| Property | Specification |
|---|---|
| Material | Yttrium (Y) |
| Purity | 99.9% |
| Size | 1” |
| Thickness | 0.125” |
| Form | Sputtering Target |
Description
Yttrium (Y) sputtering targets are used to deposit high-quality thin films across a wide range of substrate shapes and sizes. The sputtering process is highly repeatable, scalable from R&D to large-scale production, and allows precise control over film growth, structure, and chemical reactions. Reactions can occur on the target, during particle flight, or directly on the substrate depending on process conditions.
Applications
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Thin Film Deposition: Transfers target material onto substrates (e.g., silicon wafers) through controlled sputtering.
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Semiconductor Etching: Useful for high-anisotropy etching processes where selectivity is not critical.
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Material Analysis: Used in SIMS and similar methods to sputter materials for composition analysis and trace impurity detection.
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Space Research: Helps simulate space weathering effects on airless planetary bodies such as the Moon and asteroids.
