Lanthanum Titanate (LaTiO₃) Sputtering Target – Product Table
| Category | Details |
|---|---|
| Product Name | Lanthanum Titanate (LaTiO₃) Sputtering Target |
| Purity | 99.9% |
| Size | 5 inch |
| Thickness | 0.125 inch |
| Technology | Sputtering thin-film deposition |
| Process Features | Repeatable process; scalable from R&D to production |
| Chemical Reaction Behavior | Reactions can occur on target surface, in-flight, or on substrate |
| Control Characteristics | Allows precise control of film growth and microstructure |
Applications – Table Format
| Application | Description |
|---|---|
| Thin Film Deposition | Material is eroded from the target and deposited on substrates such as silicon wafers. |
| Semiconductor Etching | Used when high anisotropy is needed; selectivity is not a priority. |
| Analytical Etching | Used for removing material layers for analysis (e.g., SIMS). |
| Impurity Detection | Enables mass spectrometric detection of extremely low impurity concentrations during sputtering. |
| Space Weathering Studies | Helps simulate and study sputtering effects on airless bodies like asteroids and the Moon. |
