Lanthanum Nickel Oxide (LaNiO₃) Sputtering Target (2” × 0.125”):
| Category | Details |
|---|---|
| Product Name | Lanthanum Nickel Oxide (LaNiO₃) Sputtering Target |
| Purity | 99.9% |
| Size | 2” |
| Thickness | 0.125” |
| Description | Sputtering is a reliable method for depositing thin films from various materials onto diverse substrate shapes. The process is repeatable and scalable from small R&D projects to medium/large production batches, allowing precise control over growth and microstructure. LaNiO₃ is a metallic perovskite-type oxide with high thermal and chemical stability. |
| Key Features | • Extended oxygen-deficient compositions • Intrinsic n-type metallic conductivity • Perovskite crystal structure • Thermal and chemical stability • Suitable for thin-film deposition and electronic applications |
| Applications | • Thin-film deposition on substrates like silicon wafers • Semiconductor target etching • Analytical sputtering (SIMS) for material composition and trace impurity detection • Space applications simulating space weathering • Ferroelectric thin-film capacitors • Solid oxide fuel cells (SOFCs) • Nonvolatile ferroelectric RAM • Multilayer actuators • Oxygen and ethanol sensing layers • Catalyst precursors for organic synthesis and controlled carbon nanotube growth |
| Deposition Methods | • Sputtering (physical method) • Pulsed laser deposition • Mist plasma evaporation • Chemical vapor deposition • Metallo-organic chemical vapor deposition • Chemical solution deposition (wet chemical method). |
