Lanthanum Manganate (LaMnO3) Sputtering Targets
Product Specifications
| Property | Value |
|---|---|
| Product | Lanthanum Manganate (LaMnO3) Sputtering Targets |
| Purity | 99.9% |
| Size | 5” |
| Thickness | 0.250” |
Overview
Sputtering is a well-established technique capable of depositing thin films from a wide range of materials onto various substrate shapes and sizes. The process with sputtering targets is repeatable and can be scaled from small research projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, during transport, or on the substrate depending on process parameters. Although sputter deposition involves multiple variables, these allow experts precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for thin-film deposition, involving erosion of material from a “target” source onto a “substrate,” such as a silicon wafer. Semiconductor sputtering targets are used for etching when high etching anisotropy is needed and selectivity is not a concern. Sputtering targets are also applied in analytical techniques by removing target material.
An example is secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. During sputtering, the concentration and identity of sputtered atoms are measured using mass spectrometry. This enables determination of target composition and detection of extremely low concentrations of impurities.
Sputtering also plays a role in space applications. It is a form of space weathering, a process that alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
