Lanthanum Manganate (LaMnO₃) Sputtering Targets
Product Specifications
| Property | Value |
|---|---|
| Product | Lanthanum Manganate (LaMnO₃) Sputtering Target |
| Purity | 99.9% |
| Size | 3” |
| Thickness | 0.125” |
Overview
Sputtering is a reliable thin-film deposition method suitable for a wide range of materials and substrate geometries. The process is repeatable, scalable, and ideal for both R&D environments and medium-to-large-scale production. Depending on operational parameters, reactions may occur on the target surface, during transport, or at the substrate. Although sputtering involves many variables, this complexity provides precise control over film growth and microstructure.
Applications
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Thin-Film Deposition: Material is sputtered from a target and deposited onto substrates such as silicon wafers.
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Semiconductor Processing: Used in etching applications requiring high anisotropy even when selectivity is not critical.
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Material Analysis: Applied in SIMS, where continuous sputtering enables detection of composition and trace impurities.
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Space Science: Plays a role in space weathering, altering the physical and chemical properties of airless bodies like the Moon and asteroids.
