Copper (Cu) Micron Powder
Purity: 99.99%, Size: 100 mesh, Spherical
Technical Properties:
| Property | Value |
|---|---|
| Purity | 99.99% |
| Particle Size | 100 mesh |
| CAS | 7440-50-8 |
| Density | 8.94 g/cm³ |
| Boiling Point | 2595 °C |
| Melting Point | 1083 °C |
| Coefficient of Expansion @ 20 °C | 16.42 × 10⁻⁶ |
| Mohs Hardness @ 20 °C | 3 |
| Electric Conductance | 0.593 microhm⁻¹ |
| Crystal Structure | Cubic, Face-Centered |
| Form | Powder |
Applications:
Copper micron powder is primarily used in electronics, where its high purity and excellent electrical conductivity make it suitable for conductive components, coatings, inks, and microelectronic applications.
