Our high-purity Spherical Copper (Cu) Micron Powder (99.99%) with an ultra-fine particle size of 1µm is a premium material renowned for its exceptional electrical and thermal conductivity, high surface area, and superior processability. The spherical morphology ensures excellent flowability, uniform dispersion, and enhanced performance in applications such as conductive inks, 3D printing, sintering, and electronic components.
With its outstanding purity and precise particle size distribution, this copper powder is ideal for use in advanced manufacturing, metal additive processes, EMI shielding, and battery technologies. Its high conductivity and thermal efficiency make it indispensable for electronic applications, while its spherical shape ensures optimal packing density and reactivity in catalytic and metallurgical processes.
Manufactured under stringent quality controls, our Spherical Copper Micron Powder guarantees exceptional consistency, low oxygen content, and superior performance for both industrial and research applications. Whether for conductive pastes, powder metallurgy, or nanotechnology, this ultra-fine Cu powder delivers unmatched results.
Key Features:
✅ Ultra-High Purity: 99.99% pure copper for superior conductivity and performance
✅ Spherical Particle Shape: Ensures excellent flowability, dispersion, and packing density
✅ Optimized Particle Size: 1µm for enhanced processing and surface reactivity
✅ Exceptional Electrical & Thermal Conductivity: Ideal for electronics, conductive inks, and EMI shielding
✅ Superior Processability: Suitable for metal 3D printing, sintering, and powder metallurgy
✅ High Surface Area & Reactivity: Used in catalysts, energy storage, and nanotechnology applications
✅ Strict Quality Control: Ensures reliability, consistency, and efficiency in advanced applications
Enhance your high-performance materials with premium Spherical Copper (Cu) Micron Powder – Order now for cutting-edge applications! 🚀
