Spherical Copper (Cu) Micron Powder with 99.9% purity and a fine particle size of 325 mesh is a highly conductive and thermally efficient metal powder. With its spherical shape, this copper powder ensures excellent flowability, high packing density, and uniform distribution, making it ideal for applications in 3D printing, conductive coatings, and metal injection molding (MIM).
Key Features:
✅ High Purity: 99.9% pure Copper for superior electrical and thermal conductivity
✅ Spherical Particle Shape: Ensures excellent flowability and uniform powder distribution
✅ 325 Mesh Particle Size: Provides fine and smooth surface finish
✅ Excellent Thermal and Electrical Conductivity: Ideal for conductive inks and electronic components
✅ Corrosion and Oxidation Resistance: Enhances durability in various industrial applications
✅ Wide Industrial Applications: Used in 3D printing, metal injection molding (MIM), conductive coatings, and electromagnetic shielding
This premium Spherical Copper Micron Powder is the perfect material for high-performance electronic and industrial applications.
