Aluminum (Al) Sputtering Targets
Purity: 99.99% Size: 8” Thickness: 0.125”
Aluminum sputtering targets provide precise thin film deposition across various substrates. The sputtering process is repeatable and scalable for both small R&D projects and medium-to-large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate, offering experts precise control over film growth and microstructure.
Applications
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Thin-Film Deposition:
Uniform aluminum film deposition onto substrates such as silicon wafers. -
Semiconductor Etching:
Ideal for sputter etching where high anisotropy is required and selectivity is less critical. -
Material Analysis (SIMS):
Allows composition determination and detection of trace impurities via mass spectrometry. -
Space Applications:
Simulates space weathering, altering physical and chemical properties of airless bodies like asteroids and the Moon.
Material Advantages
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Silvery-white, soft, ductile, lightweight, strong, durable, and corrosion-resistant.
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Forms a thin but strong oxide layer for enhanced durability.
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High thermal and electrical conductivity.
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Fine-grained microstructure ensures uniform erosion and minimal particle formation during sputtering.
Aluminum sputtering targets deliver reliable performance for research, semiconductor, and advanced materials applications.
