Solderable Silver Paste
Sintering Temperature: ~850 °C, Solid Content: 75±5 wt%
Description
Solderable silver paste is an eco-friendly electrode material specially developed for high-voltage capacitor applications. After sintering, it forms a dense and smooth silver layer that ensures high conductivity, strong mechanical strength, and reliable electrical connections. The paste offers superior solderability and adhesion in both manual and reflow soldering processes. Its lead- and cadmium-free formulation enables safe production.
With proper stirring, controlled drying, and binder burnout steps, followed by sintering at 850±50 °C, optimum results are achieved. The paste is compatible with 300–500 mesh stainless steel screen printing and can be processed using either tunnel or muffle furnaces. It is an ideal solution for capacitor manufacturing that requires long-term performance, high efficiency, and process flexibility.
Technical Properties
| Property | Value |
|---|---|
| Solid Content | 75±5% |
| Viscosity | 100±20 Kcps |
| Fineness (50% Line) | ≤5 μm |
| Drying Temperature | 100–130 °C |
| Binder Burnout Temperature | ~350 °C |
| Sintering Temperature | 850±50 °C |
Applications
Ceramic Capacitor Manufacturing: Forms dense and conductive external electrodes on ceramic capacitors, especially high-voltage types, ensuring reliable electrical contact and long-term performance after sintering at elevated temperatures.
Printed Circuit Boards (PCBs): Enables low-resistance interconnections and repair of damaged traces in PCBs, offering excellent adhesion and solderability for both manual and automated soldering processes.
Flexible Electronics and Hybrid Circuits: Supports conductive layer formation on flexible substrates in hybrid circuits and flexible electronic modules used in compact devices.
Solar Cell Metallization: Used to print front-side conductive fingers and busbars on solar cells, facilitating efficient current collection and minimal resistive losses.
Sensor and Transducer Technologies: Serves as a stable electrode material in piezoelectric and pressure sensors, providing consistent conductivity and mechanical bonding to ceramic substrates.
Automotive Electronics: Ensures durable electrical connections in automotive control modules and sensor assemblies under thermal cycling and vibration, supporting long-term reliability in harsh environments.
LED and Lighting Components: Applied to ceramic-based LED packages to form solderable contacts that maintain high reflectivity and thermal stability during reflow soldering.
Consumer Electronics Assembly: Supports bonding and interconnects for small-scale devices, enabling compact layouts and high-density packaging with excellent printability and curing behavior.
