Silver Conductive Adhesive Paste
Surface Curing: 60℃~100℃ (20-40 min); Room Temperature (2~5 Hours)
Description
Silver paste, commonly known as silver conductive adhesive paste, is an essential material in the electronics industry. It primarily consists of silver particles combined with a binder and solvent, providing excellent electrical conductivity. Its capability to form strong and reliable electrical connections, along with thermal benefits, makes it a preferred material in modern electronics manufacturing.
Technical Properties
| Property | Value |
|---|---|
| Solid Content | 70 wt% |
| Viscosity | 6000-9000 CP (25℃/10rpm) |
| Decomposition Temperature | 200℃ |
| Glass Transition Temperature | 55℃ |
| Shear Strength | > 3 MPa |
| Impact Strength | > 6 kg/5000pa |
| Working Temperature | -50℃~150℃ |
| Volume Specific Resistance | 0.002 Ω/cm |
| Thermal Conductivity | 2.5 W/m·℃ |
| Surface Curing Conditions | 60℃~100℃ (20-40 min); Room Temperature (2~5 Hours) |
Applications
It has various application areas such as photovoltaic solar cells, thick-film circuits, and semiconductor die connections. Silver paste is critical in solar cell production by providing efficient electrical connections. It is also used to create conductive paths and components in thick-film circuit fabrication. Additionally, it provides a stable electrical and thermal connection between semiconductor dies and their packages, making it a highly valuable material in the electronics industry.
