Lead (Pb) Sputtering Target
Specifications:
| Property |
Value |
| Purity |
99.999% |
| Size |
1” |
| Thickness |
0.125” |
Description:
Sputtering is a proven method for depositing thin films from a wide variety of materials onto different substrate shapes and sizes. The process using sputter targets is repeatable and scalable, from small R&D projects to medium and large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on the process parameters. Despite its complexity, sputter deposition allows precise control over film growth and microstructure.
Applications:
| Application Area |
Description |
| Film Deposition |
Deposits thin films by eroding material from a target onto a substrate such as silicon wafers. |
| Semiconductor Etching |
Used where high etching anisotropy is required and selectivity is not a concern. |
| Analytical Techniques (SIMS) |
Sputtering at a constant rate allows measurement of concentration and identity of atoms, even at trace levels. |
| Space Applications |
Contributes to space weathering, altering physical and chemical properties of airless bodies like asteroids and the Moon. |
For larger inquiries, please contact us.
Download ……………………….. MSDS
