Lead (Pb) Sputtering Targets
Purity: 99.99+%, Size: 1”, Thickness: 0.250”
Technical Properties:
| Property | Value |
|---|---|
| Purity | 99.99+% |
| Size | 1” |
| Thickness | 0.250” |
Description:
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto diverse substrate shapes and sizes. The process using sputter targets is repeatable and scalable, suitable for both small research projects and medium to large production batches. Chemical reactions may occur on the target surface, in-flight, or on the substrate depending on process parameters. While sputter deposition involves many variables, it provides experts with precise control over film growth and microstructure.
Applications:
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Film Deposition: Sputtering targets are used to deposit thin films by eroding material from a target onto a substrate, such as a silicon wafer.
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Semiconductor Etching: Sputter targets are used for sputter etching when high anisotropy is required and selectivity is not a concern.
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Analytical Techniques: Sputter targets are used in analysis, such as secondary ion mass spectrometry (SIMS), where the target is sputtered at a constant rate and the composition is measured, including trace impurities.
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Space Applications: Sputtering contributes to space weathering, altering the physical and chemical properties of airless bodies like asteroids and the Moon.
