Lithium Phosphate (Li3PO4) Sputtering Targets
Purity: 99.95%, Size: 7”, Thickness: 0.125”
Sputtering is a well-established technology capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes.
The sputtering process is highly repeatable and can be scaled from small research and development projects to larger applications. The process using sputter targets can be adapted for production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate, depending on the process parameters. Although sputter deposition is complex due to its many variables, it provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Deposition performed with sputter targets is a method of creating thin films by sputtering, which involves removing material from a “target” source and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching, particularly in applications requiring high etching anisotropy where selectivity is not critical.
Sputter targets are also employed in analytical applications by gradually etching away target material. One example is secondary ion mass spectroscopy (SIMS), where the target sample is sputtered at a controlled rate. As sputtering occurs, the concentration and identity of ejected atoms are analyzed using mass spectrometry. With the aid of the sputtering target, the composition of the sample can be determined, and even extremely low impurity levels can be detected.
Sputtering also has applications in space. It is one of the mechanisms involved in space weathering, a process that alters the physical and chemical properties of airless celestial bodies such as asteroids and the Moon.
