Lithium Phosphate (Li₃PO₄) Sputtering Targets, Elastomer
Purity: 99.95%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes.
The process using sputter targets is repeatable and can be scaled from small research and development projects to larger production batches.
Sputter target processes can be adapted for medium to large substrate areas. Chemical reactions may occur on the target surface, in-flight, or on the substrate,
depending on process parameters. Although sputter deposition involves many variables and is complex, it provides experts with significant control
over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are used for film deposition. Deposition using sputter targets is a method of creating thin films by sputtering, which involves
eroding material from a “target” and transferring it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are used for etching. Sputter etching is chosen in cases where a high degree of anisotropic etching is required and
selectivity is not a concern.
Sputter targets are also used for analytical purposes by etching away the target material.
One example is secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. During sputtering, the concentration
and identity of ejected atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the target material
can be determined, allowing detection of extremely low concentrations of impurities.
Sputtering targets also have applications in space. Sputtering is one form of space weathering, a process that alters the physical and chemical
properties of airless bodies, such as asteroids and the Moon.
