Magnesium (Mg) Sputtering Targets
Purity: 99.98%, Size: 1”, Thickness: 0.125”
Sputtering is a proven technique capable of depositing thin films from a wide range of materials onto substrates of various shapes and sizes. The sputtering process is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Depending on process parameters, chemical reactions may occur on the target surface, in flight, or on the substrate. Although sputter deposition involves many variables, this complexity provides experts with significant control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are commonly used for film deposition. This method involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching, especially when high anisotropic etching is required and selectivity is not a primary concern.
Sputtering targets support analytical applications by enabling material removal for examination. A key example is secondary ion mass spectrometry (SIMS), where the target material is sputtered at a constant rate. As sputtering occurs, the concentration and identity of emitted atoms are measured with mass spectrometry. With the aid of the sputtering target, the material composition can be determined, allowing detection of extremely low impurity levels.
Sputtering targets also have applications in space science. Sputtering is one of the mechanisms of space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
