Magnesium (Mg) Sputtering Targets
Purity: 99.95%, Size: 1”, Thickness: 0.250”
Sputtering is a proven technique capable of depositing thin films from a wide variety of materials onto substrates of diverse shapes and sizes. The sputtering process is repeatable and can be scaled from small research and development projects to production batches involving medium to large substrate areas. Chemical reactions may occur on the target surface, in flight, or on the substrate depending on the process parameters. Although sputter deposition involves many variables, this complexity provides experts with precise control over film growth and microstructure.
Applications of Sputtering Targets;
Sputtering targets are widely used for film deposition. In this method, thin films are formed by sputtering, which involves eroding material from a “target” and depositing it onto a “substrate,” such as a silicon wafer.
Semiconductor sputtering targets are also used for etching, particularly when high anisotropic etching is required and selectivity is not a key factor.
Sputtering targets support analytical applications as well, achieved by etching away the target material. A common example is secondary ion mass spectrometry (SIMS), where the target sample is sputtered at a constant rate. As material is sputtered, the concentration and identity of the emitted atoms are measured using mass spectrometry. With the help of the sputtering target, the composition of the material can be determined, and even extremely low impurity levels can be detected.
Sputtering targets also have applications in space. Sputtering is one of the processes involved in space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
