Prime CZ-Si Wafer
Size: 4”, Orientation: (100), Boron Doped, 2-Side Polished
Technical Properties:
| Quality | Prime |
|---|---|
| Materials | CZ-Si |
| Size (inch) | 4” |
| Orientation | (100) |
| Coating | |
| Thickness (μm) | 525 ± 25 |
| Doping | Boron |
| Resistivity (ohm.cm) | 1-10 |
| Polished | Double Side |
Silicon is one of the most abundant elements in the Earth’s crust. The primary application of silicon wafers is in electronics and advanced technology. These wafers feature extremely flat, mirror-like surfaces and are produced using the Czochralski method to achieve high purity. Depending on the intended use, silicon wafers can be doped with various materials to adjust their purity and electrical characteristics. The type and concentration of dopants—such as gallium, indium, boron, and nitrogen—greatly influence their electronic properties.
Silicon wafers are essential components in semiconductors, microchips, integrated circuits, smartphones, computers, and other electronic devices. As the foundational platform for semiconductor components, a wafer serves as a thin substrate on which microelectronic devices are built and integrated.
