Magnesium (Mg) Sputtering Targets
Purity: 99.95%, Size: 6”, Thickness: 0.250”
Magnesium (Mg) sputtering targets are used for depositing thin films from a wide variety of materials onto substrates of different shapes and sizes. The sputtering process is repeatable and scalable, suitable for small research projects as well as medium- and large-scale production batches. Chemical reactions may occur on the target surface, during particle transit, or directly on the substrate depending on process parameters. Despite its complexity, sputter deposition allows precise control over film growth and microstructure.
Applications of Sputtering Targets
Sputtering targets are primarily employed for thin-film deposition, where material is eroded from a “target” and deposited onto a substrate such as a silicon wafer.
In semiconductor applications, sputter etching is used when high anisotropy is required and selectivity is not a concern.
Targets are also used for analytical purposes by etching away the target material.
A notable example is secondary ion mass spectroscopy (SIMS), where the sample is sputtered at a constant rate and the ejected atoms are analyzed using mass spectrometry. This allows determination of material composition and detection of extremely low levels of impurities.
Sputtering also has applications in space, contributing to space weathering—a process that changes the physical and chemical properties of airless bodies such as asteroids and the Moon.
